Company
Systems on Silicon Manufacturing Co Pte Ltd
ssmc.com
Designation
Engineering Intern
Job Type
Entry Level / Junior Executive
Job Period
Jan - Jun 2013 or Mar - Aug 2013
Profession
Engineering
Industry
Location Name
Pasir Ris
Allowance / Remuneration
$850 monthly
Job Description
Systems on Silicon Manufacturing Co. Pte Ltd (SSMC) is a joint venture of NXP B.V (NXP) and Taiwan Semiconductor Manufacturing Company (TSMC).
SSMC is in the advanced semiconductor foundry business with an investment of over $2 billion. SSMC supplies a large volume of strategic and customized integrated circuit to the global market for a wide range of applications - telecommunications, information technology, multi-media, digital consumer electronic and many more.
(Various Engineering Projects)
Project 1
Department: Process Integration
Preferred Discipline: EEE
- Analyse PCM Test structure & correlate GDS to inline to test program measurement. Documentation of PCM test structure transformation inline. Analysr root cause of high WAT OOC rate & form a team to reduce WAT OOC.
Project 2
Dpeartment: Diffusion (Chemical Mechanical Polishing)
Preferred Discipline: Mechanical Engineering
- CMP daily reports updates & modifying the reports; CMP new parts qualification, data collection & CMP equipment spare parts inventory.
Project 3:
Department: Quality & Reliability
Preferred Discipline: Computer Engineering
- Study measurement tool software program & link measured / stored data to SPC Charts; Set up new SPC Charts; Create Procedure & Training Manuals for SPC Chart
SSMC is in the advanced semiconductor foundry business with an investment of over $2 billion. SSMC supplies a large volume of strategic and customized integrated circuit to the global market for a wide range of applications - telecommunications, information technology, multi-media, digital consumer electronic and many more.
(Various Engineering Projects)
Project 1
Department: Process Integration
Preferred Discipline: EEE
- Analyse PCM Test structure & correlate GDS to inline to test program measurement. Documentation of PCM test structure transformation inline. Analysr root cause of high WAT OOC rate & form a team to reduce WAT OOC.
Project 2
Dpeartment: Diffusion (Chemical Mechanical Polishing)
Preferred Discipline: Mechanical Engineering
- CMP daily reports updates & modifying the reports; CMP new parts qualification, data collection & CMP equipment spare parts inventory.
Project 3:
Department: Quality & Reliability
Preferred Discipline: Computer Engineering
- Study measurement tool software program & link measured / stored data to SPC Charts; Set up new SPC Charts; Create Procedure & Training Manuals for SPC Chart
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