Founded in Singapore in 1994, STATS ChipPAC Pte. Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. Ranked 4th in the world Outsourced Semiconductor Assembly and Test (OSAT) industries, STATS ChipPAC offers competitive advantage of increased manufacturing scale with a combined product portfolio ranging from discrete and low lead count devices to the most advanced flip chip, wafer level, SiP and 2.5D/3D packaging solutions.
Support 2016 plant expansion in terms of onboarding support of new hires and employee lifecycle events
Improve on documentation process
Ensure compliance on MOM housing regulations
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